Ex parte MIYAZAWA et al. - Page 3




                Appeal No. 96-1805                                                                                                            
                Application 08/200,432                                                                                                        


                Goesele et al. (Goesele)                          4,883,215                Nov. 28, 1989                                      
                Hoshi et al. (Hoshi)                              5,129,827                July 14, 1992                                      
                Wells et al. (Wells)                              5,131,968                July 21, 1992                                      



                Black et al., (Black), “Silicon and Silicon Dioxide Thermal                                                                   
                Bonding For Silicon On-Insulator Applications,” J. Appl. Phys.,                                                               
                63(8), April 15, 1988, pages 2773-2777.                                                                                       
                Haisma et al. (Haisma), “Silicon-On-Insulator Wafer Bonding-Wafer                                                             
                Thinning Technological Evaluations,” Japanese Journal of Applied                                                              
                Physics, Vol. 28, No. 8, August 1989, pages 1426-1443.                                                                        
                The appellant’s admitted prior art as set forth on page 2, lines                                                              
                17-21, page 8, line 4-page 9, line 17, and Figures 4A-4D.                                                                     

                                                           THE REJECTIONS                                                                     
                         Claims 1, 3 through 17, 20 and 21 stand rejected under 35                                                            
                U.S.C.  103 as being unpatentable over the admitted prior art in                                                             
                view of Wells, Hoshi and Black, considered either together or                                                                 
                further in view of Goesele.2                                                                                                  
                         Claims 9 and 17 through 19 stand rejected under 35 U.S.C.                                                           
                103 as being unpatentable over the references cited against claim                                                             
                1 et al. taken further in view of Haisma.                                                                                     


                         2We note that claim 8, as it appears in the appendix to the                                                          
                Brief, is dependent from claim 2, which has been canceled.                                                                    
                However, inspection of Amendment A (Paper No. 6), in which claim                                                              
                8 first was presented, reveals that it properly depends from                                                                  
                claim 1.  We also note that a rejection of claims 4 and 5 under                                                               
                35 U.S.C.  112, second paragraph, was overcome by an amendment                                                               
                filed after the final rejection (Paper No. 13).                                                                               
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