Ex parte MIYANO et al. - Page 1




          The opinion in support of the decision being entered today was not written for
                   publication and is not binding precedent of the Board.             
                                                            Paper No. 21              

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                    _____________                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                    _____________                                     
               Ex parte ICHIRO MIYANO, KOJI SERIZAWA, HIROYUKI TANAKA,                
                         TADAO SHINODA and SUGURU SAKAGUCHI,                          
                                    _____________                                     
                                Appeal No. 1999-0884                                  
                             Application No. 08/464,577                               
                                   ______________                                     
                                HEARD: April 3, 2001                                  
                                   _______________                                    

          Before BARRETT, FLEMING and BARRY Administrative Patent Judges              
          FLEMING, Administrative Patent Judge.                                       


                                 DECISION ON APPEAL                                   
               This is a decision on appeal from the final rejection of               
          claims 6-9 and 24-43, the only claims pending in the                        
          application.                                                                
               The invention relates to a method for forming a film                   
          carrier tape for a semiconductor device, and for forming a                  
          laminated multi-chip semiconductor device that includes a                   


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