Appeal No. 1999-0884
Application No. 08/464,577
punched out of sheet metal; while the detailed
description in Kitano is silent as to the method of forming
the heat transfer cap, the drawings suggest that the heat
transfer cap is punched, just as the chip pad 2 is punched
(see, for example, Figs. 1-3), and the Examiner does not
contravene Appellants’ assertion that Kitano's heat sink is
punched. We therefore find that the heat transfer cap of
Kitano is not formed by etching a metallic layer. Because
neither Sugano nor Kitano teaches a heat sink formed by
etching a metallic layer, the combination advanced by the
Examiner does not contain every element of the invention
recited in claim 6.
Appellants' claim 24 recites a method of forming a
laminated multi-chip semiconductor device comprising stacking
a plurality
of chip semiconductor devices in layers on a substrate, (each)
chip semiconductor device formed by the steps of electrically
connecting a chip to the leads of a film carrier tape,
mounting a heat sink to a surface of the semiconductor chip,
separate from those connected leads, and electrically
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