Appeal No. 1999-0884
Application No. 08/464,577
along with, and separate from, metallic leads to be connected
to a semiconductor device; we further fail to find any
suggestion or reason to form a stacked multi-chip
semiconductor structure wherein a heat sink is mounted to the
surface of each chip in the stack. Sugano does not suggest
the desirability of providing a heat sink or sinks to radiate
heat from the TAB type multi-chip structure disclosed. Kitano
teaches a heat sink for a chip semiconductor device, but does
not suggest the desirability of forming such a heat sink by
etching; neither does Kitano suggest placing each chip in a
stacked multi-chip structure in thermal contact with an
associated heat sink. Takahashi, Otaka and Kuraishi were not
relied upon by the Examiner to teach process steps for forming
or constructing heat sinks, and in any case do not teach or
suggest the elements missing from Sugano and Kitano.
Therefore, we will not sustain the rejection of claims 6-9 and
24-43 under 35 U.S.C. § 103(a) as being unpatentable over
Sugano, Kitano, Takahashi, Otaka, and Kuraishi.
In view of the foregoing, the decision of the Examiner
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