Appeal No. 1999-0884
Application No. 08/464,577
heat sink. Therefore, the combination advanced by the
Examiner fails to teach every element recited in claim 24.
Appellants' Claim 37 recites a method of forming a
laminated multi-chip semiconductor device. Many limitations
are very similar to those contained in claim 24; in
particular, claim 37 recites "for at least an intermediate
layer of the at least three layers of the chip semiconductor
devices ... providing a heat sink separate from the leads
electrically connected to the
semiconductor chip at a surface of the semiconductor chip for
enabling heat radiation therefrom." As noted, supra, in the
discussion of claim 24, neither Sugano nor Kitano teaches a
stacked multi-chip semiconductor device provided with a heat
sink or sinks so that each semiconductor chip is in thermal
contact with a heat sink. Therefore, the combination advanced
by the Examiner fails to teach every element recited in claim
37.
Claims 7-9, 25-36, and 38-43 depend from independent
claims 6, 24, and 37, respectively, and incorporate every
limitation of the independent claim from which they depend.
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