Appeal No. 1999-0884
Application No. 08/464,577
connecting a heat sink connector to the leads of the film
carrier tape.
Upon a careful review of Sugano and Kitano, we fail to
find that these references teach a stacked multi-chip
structure in which each chip has an associated heat sink for
radiating away
generated heat. We agree with the Examiner that Sugano
teaches stacking a plurality of chip semiconductor devices
15a-c in layers on a substrate 20, each device formed by
electrically connecting the chip to a film carrier tape 2a
having leads 3a. As noted supra, the Examiner admits that
Sugano does not teach a heat sink, but advances Kitano as
teaching a heat sink. We note that claim 24, unlike claim 6,
does not require that the heat sink be etched from a metallic
layer. Nevertheless, Kitano does not supply the missing
teaching, because the heat transfer cap contained in Kitano
contacts only the upper chip of a semiconductor device
structure. Neither Sugano nor Kitano teaches a stacked multi-
chip semiconductor device provided with a heat sink or sinks
such that each semiconductor chip is in thermal contact with a
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