Appeal No. 1999-0884
Application No. 08/464,577
Appellants' claim 6 recites a method of forming a film
carrier tape for a semiconductor device, comprising the steps
of superposing a metallic layer on a carrier member and
etching the metallic layer to form (a) metallic leads and (b)
a heat sink separate from the metallic leads.
Upon a careful review of Sugano and Kitano, we fail to
find that these references teach the step of etching the
metallic layer on a carrier member to form both metallic leads
and a heat sink separate from the metallic leads, as claimed
in independent claim 6. We agree with the Examiner that
Sugano teaches forming a film carrier tape, superposing a
metallic layer on the carrier member, and etching the metallic
layer so as to form metallic leads (see column 5, lines 29-
34). We agree that Kitano teaches a heat sink 7, having
radiation fins in some embodiments, contacting a semiconductor
chip so as to radiate heat away from the chip (see column 5,
line 67 to column 6, line 2). Neither reference, however,
teaches etching the metallic layer on a carrier member to form
such a heat sink. The Examiner admits that Sugano does not
teach a heat sink. Appellant asserts that the "heat transfer
cap" of Kitano is not etched from a metallic layer, but rather
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