Appeal No. 1999-0884
Application No. 08/464,577
plurality of chip semiconductor devices stacked in multiple
layers on a substrate.
The method of forming a film carrier tape comprises the
steps of superposing a metallic layer on a carrier member
(page 6, lines 13-16) and etching the metallic layer so as to
form metallic leads (page 6, lines 16-18) and a heat sink
(page 6, lines 19-28) separate from the metallic leads. The
heat sink is to be formed in a direction transverse to that in
which the metallic leads extend (page 6, lines 19-28; Figs. 1
and 2). The metallic leads are connected to the semiconductor
chip and/or a connector therefor (page 7, lines 4-6), and the
heat sink is coupled to the semiconductor device to radiate
heat therefrom (page 6, lines 23-28).
The method of forming a multi-chip semiconductor device
comprises the steps of providing a film carrier tape with
leads (page 6, lines 11-13), electrically connecting a
semiconductor chip to the leads of the film carrier tape (page
7, lines 4-7), mounting a heat sink to a surface of the
semiconductor chip
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