Appeal No. 1999-0884
Application No. 08/464,577
(page 7, lines 7-11), and providing a connector for the
mounting of the heat sink (page 7, line 26 to page 8, line 8).
The film carrier tape has a superimposed metallic layer, which
is etched to form the leads and heat sink for the
semiconductor chip
(page 6, lines 16-23); the metallic leads extend in a first
direction, and the heat sink extends in a second direction
transverse to the first (page 6, lines 19-28; see Figs. 1 and
2). At least one positioning mark is provided on the heat
sink
(page 7, line 28 to page 8, line 8), and a corresponding mark
is provided on the connector, corresponding to the first mark.
A heat conducting pattern is formed on the substrate (page 9,
lines 1-17), and the heat sink is connected to the substrate
through the conducting pattern. An opening may be provided in
the heat sink (page 10, lines 3-11), overlaying the
semiconductor chip. Radiation fins may be provided at an
outer exposed portion of the heat sink (page 12, lines 6-9).
A heat insulator may be provided between adjacent ones of the
semiconductor chip devices to
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