Ex Parte NAKAMURA et al - Page 10



          Appeal No. 2000-0660                                                        
          Application No. 08/985,278                                                  

          re Robertson, 169 F.3d 743, 745, 49 USPQ2d 1949, 1950 (Fed. Cir.            
          1999) citing Continental Can Co. v. Monsanto Co., 948 F.3d 1264,            
          1268, 20 USPQ2d 1746, 1749 (Fed. Cir. 1991).  "Inherency,                   
          however, may not be established by probabilities or                         
          possibilities.  The mere fact that a certain thing may result for           
          a given set of circumstances is not sufficient."  Id. citing                
          Continental Can Co. v. Monsanto, Co., 948 F.3d 1264, 1269,                  
          20 USPQ2d 1746, 1749 (Fed. Cir. 1991).                                      
               Upon careful review of Hayabuchi, we fail to find that                 
          Hayabuchi teaches:                                                          
               . . . said insulation film comprising a nitride film                   
               and top oxide film on said nitride film, the thickness                 
               of said top oxide film being set to a thickness so that                
               the amount of transition of the carriers passing                       
               through the top oxide film is almost equal to or larger                
               than the amount of transition of the carriers passing                  
               through the tunnel film under a read voltage applied to                
               said gate electrode,                                                   
          as recited in Appellants' claim 5.  Rather, we find that                    
          Hayabuchi forms a second oxide layer 5 (i.e. the top oxide layer)           
          having a thickness of approximately 4 nm over the silicon nitride           
          layer 4.  See column 3, lines 65-68.  Further, a silicon layer 6            
          is formed over layer 5 and a resist 8 is formed on layer 6.  Then           
          the silicon layer 6 is completely etched away and approximately 1           
          nm or more of the second oxide layer 5 may remain.  See column 4,           

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