Ex Parte YOSHIHARA et al - Page 1



            The opinion in support of the decision being entered today was not written
                   for publication and is not binding precedent of the Board.         
                                                                Paper No. 33          
                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                  
                                     ____________                                     
               Ex parte SHINJI YOSHIHARA, FUMIO OHARA and MASAO NAGAKUBO              
                                     ____________                                     
                                 Appeal No. 2001-2082                                 
                              Application No. 08/943,146                              
                                     ____________                                     
                                HEARD: AUGUST 14, 2002                                
                                     ____________                                     
          Before KRASS, LALL and SAADAT, Administrative Patent Judges.                
          SAADAT, Administrative Patent Judge.                                        

                                  DECISION ON APPEAL                                  
               This is a decision on appeal from the Examiner’s final                 
          rejection of claims 1-3 and 18-25, which are all of the claims              
          pending in this application.                                                
               We reverse and enter a new ground of rejection under 37 CFR            
          § 1.196(b).                                                                 
                                     BACKGROUND                                       
               Appellants’ invention is directed to bonding of two                    
          substrates in a semiconductor device using a gold-silicon                   

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