Appeal No. 2001-2082
Application No. 08/943,146
a gold layer interposed between the eutectic portion
and the second substrate and directly contacting a second
surface of the eutectic portion on an opposite side of the
first substrate.
21. A semiconductor device comprising:
a first substrate having a surface portion;
a second substrate bonded to the first substrate only
at the surface portion of the first substrate; and
an eutectic portion made of silicon and gold and
interposed between the first substrate and the second
substrate, the eutectic portion contacting the entire
surface portion of the first substrate.
The Examiner relies on the following reference in rejecting
the claims:
Mikkor 4,701,424 Oct. 20, 1987
Claims 1-3 and 18-25 stand rejected under 35 U.S.C. § 102(b)
as being anticipated by Mikkor.1
Rather than reiterate the viewpoints of the Examiner and
Appellants, we make reference to the answer (Paper No. 28, mailed
September 12, 2000) for the Examiner’s complete reasoning in
support of the rejection, the appeal brief (Paper No. 27, filed
1 The 35 U.S.C. § 112 rejection of claim 18, as indicated in the final
rejection (Paper No. 19, mailed August 19, 1999) was overcome by Appellants’
amendment to the claim (Paper No. 21, filed January 19, 2000). In an Advisory
Action (Paper No. 25, filed May 23, 2000), the Examiner indicated that the
amendment would be entered upon filing a Notice of Appeal.
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