Ex Parte SANDHU - Page 9




                Sandhu Preliminary Motion 2                                                                                                 
                        Sandhu’s Position                                                                                                   
                F 37. Sandhu has filed a preliminary motion asserting that all of  Leung’s involved claims, Claims                          
                        13, 19, 20 and 26, are unpatentable under 35 U.S.C. § 112, ¶ 1.  Paper 69.                                          
                F 38. Sandhu asserts that each of Leung’s involved claims are unpatentable because Leung’s                                  
                        written description “fails to provide an enabling disclosure or written description of the                          
                        claimed subject matter.”  Paper 69, p. 2.                                                                           
                F 39. In particular, Sandhu argues that each of the involved claims require a post treatment with a                         
                        hydrogen plasma which must reduce (1) the carbon content and (2) the resistivity of the                             
                        deposited layer.  Paper 69, p. 4.                                                                                   
                F 40. Sandhu argues that the 143 Specification2 does not provide a written description of reducing                          
                        carbon content and decreasing resistivity without a post-treatment including biasing the                            
                        substrate:                                                                                                          
                                The [143 Application] does not teach any method to “reduce the carbon                                       
                                content” and “decrease the resistivity” of any layer deposited by chemical                                  
                                vapor deposition without including the biasing of the substrate.  This biasing                              
                                step is understood from the Leung . . . application by those of skill in the art                            
                                (see Vasilyeva Affidavit ¶ 15-16) to be required and essential to reduce carbon                             
                                content and decrease resistivity by the . . . specification, but is not included as                         
                                part of the limitations of Leung claims 13, 19, 20, or 26.  As stated in                                    
                                the. . . specification, the invention is “a post treatment of films formed via                              
                                chemical vapor deposition by exposure of the deposited film to an inert                                     
                                plasma while biasing the substrate.  This is the only process described by the                              
                                . . . specification that accounts for any improvement of a film by possibly                                 
                                lowering carbon content and decreasing resistivity.                                                         
                        Paper 69, pp. 9-10 (bracketed material added, footnote omitted, underlining and italics                             
                        original).                                                                                                          




                        2       Sandhu’s comments were specifically made with respect to the specification of the great grandparent         
                application, Application 08/339,521.  However, the comments are equally applicable to the specification of the 143          
                Application since the text of the great grandparent specification appears to be and is said to be identical to the text of  
                the 143 Specification.  See F6 and F7, above.  We need not consider the content of the parent and grandparent               
                applications since Leung has disclaimed reliance on whatever additional description is present in those applications.       
                Paper 104, p. 15.                                                                                                           
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