Ex Parte SANDHU - Page 25




                        Sandhu argues that Leung’s claims are not supported, inter alia, because the specification does                     
                not provide a written description of a process for controlling the carbon content and resistivity of                        
                CVD films without the step of biasing the film.  Thus, Sandhu argues that the original 143                                  
                Specification                                                                                                               
                                does not teach any method to “reduce the carbon content” and “decrease the                                  
                                resistivity” of any layer deposited by chemical vapor deposition without                                    
                                including the biasing of the substrate.                                                                     
                Paper 69, p. 9.                                                                                                             
                                                                     C.                                                                     
                        None of Leung’s involved claims require biasing the substrate or otherwise subjecting the                           
                substrate to high energy ions during the post-treatment exposure to plasma in order to decrease                             
                carbon content and resistivity.  With respect to decreasing carbon and lowering resistivity, Leung’s                        
                involved claims merely require subjecting the films to a hydrogen plasma.  Thus, Claims 13 and 19                           
                only require:                                                                                                               
                                post-treating said wafer in said reactor with hydrogen gas and generating                                   
                                plasma to reduce the carbon content of said layer and thereby decrease the                                  
                                resistivity of said layer.                                                                                  
                Leung’s Claims 20 and 26 similarly require only:                                                                            
                                post-treating said wafer in said reactor with hydrogen gas and generating                                   
                                plasma to reduce the carbon content of said metal nitride and thereby decrease                              
                                the resistivity of said layer.                                                                              
                        Looking at the entirety of the original 143 Specification, we find, for the reasons detailed                        
                below, that the invention described in the 143 Specification requires the use of high energy ions as                        
                part of the disclosed process for improving the properties of CVD films.  The 143 Specification does                        
                not describe a process for decreasing resistivity and the carbon content of CVD films without                               
                bombarding the film with high energy ions.  The 143 Specification does not convey possession of                             
                an invention to improve resistivity and decrease carbon content which does not employ bombardment                           
                with high energy ions.  None of Leung’s involved claims require the use of high energy ions.  Thus,                         
                when Claims 13, 19, 20 and 26 were added by preliminary amendment to provoke an interference,                               
                the scope of the Leung invention was broadened beyond the invention described in the original 143                           
                Specification and added prohibited new matter to the 143 Specification.  Claims 13, 19, 20 and 26                           
                are unpatentable under 35 U.S.C. § 112, ¶ 1, for failing to be supported by a written description.                          
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