Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
Appendix 1
Drawings of application, as filed
Brief description of the drawings of Gedney et al., U.S. Patent 5,483,421, of which
the present applicant seek reissue (drawing sheets 1-3 are attached).
FIGURE 1 is a longitudinal section view, somewhat diagrammatic, showing the
connection of a ceramic chip carrier to a glass filled organic circuit board card
(FR-4) by means of solder ball connections, and depicting the stress pattern
generated at elevated temperature due to thermal mismatch.
FIGURE 2 is a graph plotted to depict the relative deformation of a circuit board
card and ceramic module under thermal stress showing the average normal strain
in each solder ball connection.
FIGURE 3 is a graph showing the relative shear displacement between a circuit
board and a ceramic module showing strain in the planar direction between the
board and module and the average shear strain in each solder ball.
FIGURE 4 is an exploded perspective view showing the mounting of chips onto a
carrier and carrier onto a circuit card according to the present invention.
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