Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
13. (NEW) The package as defined in claim 1 wherein the thickness of the
conductors on said chip carrier is thinner than the wires of the wiring on the circuit
board.
14. (NEW) The package as defined in claim 7 wherein the thickness of the
conductors on said chip carrier is thinner than the wires of the wiring on the circuit
board.
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