Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
wiring on said circuit board connected to said second set of bonding pads.
22. A package according to claim 21 wherein the thermal coefficient of
expansions of the material of the chip carrier and the material of the circuit board
do not differ by more than about 20%.
23. The package of claim 21 wherein said chip carrier and said circuit board
are formed of the same material.
24. A package according to claim 21 wherein said material is formed of a
glass filled epoxy.
25. A package according to claim 21 wherein said material is a formed of a
polyimide.
Claims 26-33. (Cancelled)
Claim 34. [see next page]
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