Ex parte MEHTA - Page 5




          Appeal No. 1999-2683                                                         
          Application 08/754,564                                                       

          that the product would have been obvious over the combination                
          of Tsu, Kalnitsky, and the APA (Final Rejection, pp. 4-5).                   
               We refer to the final rejection (Paper No. 11) (pages                   
          referred to as "FR__") and the examiner's answer (Paper                      
          No. 21) (pages referred to as "EA__") for a statement of the                 
          Examiner's position, and to the appeal brief (Paper No. 20)                  
          for a statement of Appellant's arguments thereagainst.                       
                                       OPINION                                         
          Arguments                                                                    
               The Examiner finds that oxide layer 24 in Tsu is                        
          inherently an etch stop layer for the overlying spin-on-glass                
          (SOG) layer 26 and concludes that it would have been obvious                 
          to substitute a silicon nitride etch stop layer as taught by                 
          Kalnitsky.                                                                   
               Appellant argues that CVD oxide layer 24 in Tsu is not                  
          stated to be an etch stop layer and could not be effectively                 
          used as an etch stop layer.  Appellant provides a declaration                
          by the inventor Sunil Mehta under 37 CFR § 1.132 (Paper                      
          No. 10) which states (p. 2):                                                 
                    4.  To the best of my knowledge on information and                 
               belief, the industry accepted definition of an etch stop                
               layer is a layer of material underlying the material                    
               being etched and having a lower etch rate than the                      
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