Appeal No. 2001-2455
Application 08/439,490
26. A sputtering apparatus comprising:
a vacuum chamber surrounded by a chamber wall and
having a substrate support mounted therein;
a sputtering cathode assembly mounted in an opening in
the chamber wall, the cathode assembly including a housing, a
plasma shaping and confining magnet assembly carried by the
housing, and a target assembly removably connected to the
housing;
the target assembly including:
a replaceable target unit having a back and formed
at least in part of a volume of sputtering material
having a front sputtering face thereon, and
a cooling jacket connected in water-sealing
relationship to the back of the target unit to enclose
a cooling water cavity between the cooling jacket and
the target unit, the target unit having a rear face
positioned to be in direct cooling contact with flowing
cooling water within the cavity, the cooling jacket
being removable with the target from the cathode
assembly;
an electrical insulator between the cathode assembly
and the chamber wall around the opening and surrounding the
sputtering face of the target; and
a power supply having a negative output connected to
the cathode assembly and a positive output connected at least
indirectly to the chamber wall.
40. A replaceable sputtering target for use in a
sputtering apparatus having a vacuum chamber surrounded by a
chamber wall and having a substrate support mounted therein, a
sputtering cathode assembly mounted in an opening in the chamber
wall, the cathode assembly including a housing, a plasma shaping
and confining magnet assembly carried by the housing, and a
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