Appeal No. 2001-2455
Application 08/439,490
35 U.S.C. § 103 as unpatentable over Schuhmacher in view of
Urbanek or Demaray.
3. Claims 1-26 and 29-41 stand rejected under
35 U.S.C. § 103 as unpatentable over Kerschbaumer in view of
Urbanek and Demaray.
4. Claims 27 and 28 stand rejected under 35 U.S.C.
§ 103 as unpatentable over Landau in view of Urbanek, Demaray and
Henderson.
5. Claims 27 and 28 stand rejected under 35 U.S.C.
§ 103 as unpatentable over Schuhmacher in view of Urbanek,
Demaray and Henderson.
6. Claims 27 and 28 stand rejected under 35 U.S.C.
§ 103 as unpatentable over Kerschbaumer in view of Urbanek,
Demaray and Henderson.
We reverse as to all six grounds of rejection.
BACKGROUND
The invention relates to sputter coating for use in the
application of thin films to substrates in the manufacture of
semiconductor wafers. Appeal Brief, Paper No. 15, received
July 27, 1998, page 2. During a sputtering process, heat is
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