Interference No. 105,113
In reaching this conclusion, we are mindful that the systems depicted in Figure 17 are specifically
described as showing how the embodiments of annealing apparatus shown in Figures 11-15 can
be integrated into a wet chemical tool set (id. at 5, ll. 20-21, and p. 27, ll. 20-22). As discussed
below, in addition to generating lower-than-traditional annealing temperatures, these
embodiments advantageously produce temperature gradients in the wafers and copper
metallization layers.
As further evidence that the inventors did not consider their plating systems to be limited
to annealing stations of the temperature-gradient type, we note that originally filed apparatus
claims 41-44 recite the combination of a deposition station, an annealing station, and workpiece-
handling robots without requiring temperature-gradient annealing, which instead is recited in
dependent claims 45-54.
For the foregoing reasons, we agree with Ritzdorf that the '613 application describes an
electroplating system satisfying all of the limitations of claim 70, which is identical to Cheung
claim 1 and thus the count:
70. A system for depositing a layer on a substrate, comprising:
at least one electrolyte processing cell;
at least one annealing chamber;
at least one substrate cleaner; and
a substrate transfer apparatus adapted to access the electrolyte processing
cell, the annealing chamber, and the substrate cleaner.
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