CHEUNG et al vs. RITZDORF et al - Page 23




                Interference No. 105,113                                                                                                      

                such support is also provided by Figures 16 and 17 when employed with at least one of the                                     
                temperature-gradient annealing apparatuses shown in Figures 11-15, which "create[] a                                          
                temperature gradient through the cross-section of the workpiece [wafer] 490," thereby producing                               
                in the copper film 510 "a stress gradient that provides a driving force which promotes                                        
                recrystallization of the copper film 510."  Id. at 24, ll. 5-10.   This temperature gradient is                               
                represented by temperature regions T1-T5 in Figure 8:                                                                         













                Of the five different embodiments of annealing apparatus for producing such temperature                                       
                gradients, Figure 11, the most relevant, is reproduced below:                                                                 











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