Interference No. 105,113 such support is also provided by Figures 16 and 17 when employed with at least one of the temperature-gradient annealing apparatuses shown in Figures 11-15, which "create[] a temperature gradient through the cross-section of the workpiece [wafer] 490," thereby producing in the copper film 510 "a stress gradient that provides a driving force which promotes recrystallization of the copper film 510." Id. at 24, ll. 5-10. This temperature gradient is represented by temperature regions T1-T5 in Figure 8: Of the five different embodiments of annealing apparatus for producing such temperature gradients, Figure 11, the most relevant, is reproduced below: - 23 -Page: Previous 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 NextLast modified: November 3, 2007