Interference No. 105,113
We reach the same conclusion with respect to independent claims 6813 and 73.14 The "loading
station" recited in claim 68 reads on the I/O portion of the prior-art system shown in
Figures 16 and 17, which we conclude was also contemplated by the inventors for use with the
aforementioned annealing "oven." The "mainframe" and "mainframe wafer transfer robot"
recited in claim 73 read on the overall structure and robots 620 in the Figure 16 system, which
we likewise conclude was contemplated for use with the aforementioned annealing "oven." The
recited "electrolyte supply" is not shown in Figure 1 but will necessarily be connected to the fluid
inlet line 165 ('613 specification at 7, l. 2).
In addition to concluding that written description support for claims 68, 70, and 73 is
provided by the annealing "oven" disclosure, we agree with Ritzdorf's alternative argument that
13 Claim 68 reads:
68. An electro-chemical deposition system, comprising:
a) a wafer transfer apparatus;
b) a loading station disposed in connection with the wafer transfer apparatus;
c) one or more processing cells disposed in connection with the wafer
transfer apparatus;
d) an electrolyte supply fluidly connected to the one or more processing cells;
e) a wafer cleaner station disposed in connection with the wafer transfer
apparatus; and
f) a thermal anneal chamber disposed in connection with the wafer
transfer apparatus.
14 Claim 73 reads:
73. An electro-chemical deposition system, comprising:
a) a mainframe having a mainframe wafer transfer robot;
b) a loading station disposed in connection with the mainframe;
c) one or more processing cells disposed in connection with the mainframe;
d) an electrolyte supply fluidly connected to the one or more processing cells;
e) a rinse-dry (RD) chamber disposed for access to the loading station; and
f) a thermal anneal chamber disposed for access to the loading station.
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