Appeal 2006-1454
Application 09/004,524
Patent 5,483,421
coefficient of thermal expansion of at least 17 x 10-6 ppm/C°” has
been completely left out of these claims;
(2) reissue claims 24 and 25 are broader than the original patent claims in
that the coefficient of thermal expansion of the chip carrier (i.e., “at
least 17 x 10-6 ppm/C°”) has been completely left out of these claims;
(3) the broader aspects of the reissue claims relate to surrendered subject
matter because “claims 1 and 7, as originally filed in patent
Application '467 [and cancelled during prosecution], correspond to
claims 21 and 34, respectively, of the instant Reissue Application
except that Reissue claims 21 and 34 now each include the limitation
‘an encapsulation material encapsulating said first set of solder
connections’”;
(4) “this [encapsulation material] limitation was not considered to be
germane to the prior art rejection given in Application '467” as “[t]his
feature was taught by several references cited by [the Examiner]
during prosecution of Application '467”;
(5) “Applicants repeatedly distinguished the amended (patented) claims of
Application '467 over the prior art by arguing that the prior art fails to
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