Appeal 2007-0908
Application 10/152,077
Principal Embodiment
35. Ueno describes, with reference to Figure 3, a version of the cleaning
apparatus that has three nozzles, chemical liquid nozzle 6, rinse nozzle 7,
and replacing medium nozzle 8, each having a proximal portion inserted into
rotation shafts 61, 71, and 81, which are fitted with rotation means 62, 73,
and 83. (Ueno at 5:20-31.)
36. According to Ueno, in the retreat position, each nozzle is placed
outside the outer cup, while in the supply position, each of the nozzles "faces
a portion near the center of the wafer W," except that the tip of rinsing
nozzle 7 is slanted and placed a little distant from the center so that replacing
medium nozzle 8 is located above the center of the wafer W. (Ueno
at 5:31-43; see also Ueno Figures 5B and 5C, supra.)
Another Embodiment
37. Ueno teaches a modified apparatus that is said to allow the IPA vapor
to spread uniformly on the surface of the wafer in Figure 10A. (Ueno
at 12:17ff.)
{Figure 10A is shown below:}
{Figure 10A is said to show a modified apparatus.}
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