Appeal 2007-0908
Application 10/152,077
contained in the pure water. It follows that particles are less
generated to result in an increase in yield. It should be noted
that IPA essentially contains no impurities.
(Ueno at 6:61-67.)8
27. Ueno describes, with reference to Figures 5B and 5C, a spin cleaning
method in which pure water is used as the rinsing liquid and IPA vapor is
used as the replacing medium.
{Ueno Figures 5B and 5C are shown below:}
{Ueno Figures 5B and 5C are said to show a spin cleaning method.}
28. According to Ueno, after a chemical etch treatment, rinsing nozzle 7
and replacing medium nozzle 8 are put into position and the rinsing liquid,
8 Mohindra, at 9:65-10:11, provides a similar explanation of the role of the
Marangoni effect in cleaning wafers.
10
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